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AI Humanoid Robot R&D Test Plan

The year 2024 is widely regarded as the first year of humanoid robot commercialization, and the global humanoid robot industry is entering a period of unprecedented development opportunities. According to the report released at the first China Humanoid Robot Industry Conference, the Chinese humanoid robot market reached approximately RMB 2.76 billion in 2024 and is expected to grow to RMB 75 billion by 2029, accounting for 32.7% of the global total. By 2035, the market size is expected to exceed RMB 300 billion.

2024 Market Size RMB 2.76 Billion
2029 Forecast RMB 75 Billion
2035 Long-Term Scale Over RMB 300 Billion
Test Coverage 6 Core Modules

1. Overview

The year 2024 is widely regarded as the first year of humanoid robot commercialization, and the global humanoid robot industry is entering a period of unprecedented development opportunities. According to the report released at the first China Humanoid Robot Industry Conference, the Chinese humanoid robot market reached approximately RMB 2.76 billion in 2024 and is expected to grow to RMB 75 billion by 2029, accounting for 32.7% of the global total. By 2035, the market size is expected to exceed RMB 300 billion.

With the rapid breakthroughs in AI large-model technology, humanoid robots have shifted from traditional pre-programmed modes to a new stage of embodied intelligence. Large models effectively provide robots with a "brain," enabling higher-level abstract understanding and reasoning capabilities. Leading companies such as Tesla Optimus, Figure, Unitree, and UBTECH have launched new-generation products and achieved batch deployment in industrial manufacturing, warehouse logistics, and other scenarios.

As mobile terminals integrating AI technology, software algorithms, motion control, and hardware structure, humanoid robots involve core modules such as intelligent perception, power systems, decision and control, joint actuation, and dexterous hands. Each module requires rigorous testing and validation. Key testing challenges include signal integrity verification for multi-sensor fusion perception, safety testing for high-power-density power systems, reliability verification for high-speed data transmission, and motion control precision testing for precision actuators.

To address these challenges, it is necessary to establish a complete testing system covering the entire chain from intelligent perception, power endurance, and decision control to joint actuation and dexterous hand operation, ensuring that the performance indicators of each functional module meet design requirements.

2. Overall Architecture of the Test Plan

By function, AI humanoid robots can be divided into six core modules:

Intelligent Perception Module

Includes camera sensors, radar sensors, microphone arrays, IMU inertial measurement units, and more, responsible for environmental perception, object recognition, voice interaction, and posture detection.

Power Module

Centered on battery packs and cell assemblies, providing power support for the whole machine, with requirements for high energy density, long endurance, and fast charging capability.

Decision and Control Module

Includes intelligent chips, controllers, ECUs, and more, responsible for information processing, decision planning, and control execution.

Joint Module

Composed of linear actuators, rotary actuators, frameless torque motors, harmonic reducers, and more, enabling precise movement of all body parts.

Dexterous Hand Module

Includes coreless motors, stepper motors, planetary reducers, tactile sensors, and more, enabling fine manipulation capability.

Other Modules

Covers auxiliary systems such as structural parts, communication devices, and heat dissipation devices.

Layered Architecture Design

The test plan adopts a layered architecture design. Physical-layer testing focuses on signal integrity testing of physical interfaces such as MIPI D-PHY/C-PHY, GMSL/FPD-LINK, and PCIe. Device-layer testing evaluates performance parameters of key devices such as battery cells, motors, and sensors. System-layer testing performs functional verification and reliability testing after module integration. The test flow follows a progressive principle of "device verification - module integration - system joint debugging."

3. Intelligent Perception Module Test Plan

3.1 Test Objects

The intelligent perception module test objects include camera sensors (main vision cameras, depth cameras, infrared cameras, etc.), radar sensors (LiDAR, millimeter-wave radar, ultrasonic sensors, etc.), microphone arrays, and IMU inertial measurement units (accelerometers, gyroscopes, magnetometers, etc.).

3.2.1 MIPI D-PHY/C-PHY Signal Integrity Testing

The MIPI interface is the primary data channel between camera sensors and the main control chip. Electrical characteristic testing uses high-performance oscilloscopes with automation software to measure key transmitter output parameters such as rise time, fall time, eye opening, and common-mode voltage. C-PHY testing includes parameters such as static point common-mode voltage VCPTX, common-mode voltage mismatch ΔVCMTPX, and intra-pair skew.

Timing characteristic testing verifies switching timing between high-speed (HS) mode and low-power (LP) mode, ensuring that data transmission timing margin meets specification requirements. Eye diagram analysis evaluates long-term signal quality stability by analyzing jitter components.

3.2.2 GMSL/FPD-LINK Video Transmission Testing

GMSL and FPD-LINK are used for long-distance video signal transmission. Signal quality testing uses high-speed oscilloscopes to measure parameters such as signal amplitude, frequency response, and impedance matching. Link integrity testing checks bit error rate (BER), link training time, and adaptive equalization performance. Video data integrity testing verifies complete frame transmission and detects frame loss and data errors.

3.2.3 Test Equipment Configuration

Recommended test equipment includes high-performance oscilloscopes (bandwidth ≥ 3.5GHz), MIPI D-PHY/C-PHY automation test software, low-loading high-impedance probes, and arbitrary waveform generators.

4. Power Module Test Plan

4.1 Test Objects

The power module centers on battery packs and cell assemblies. Test objects include individual cells, battery modules, and battery pack systems (including BMS, thermal management devices, and structural parts).

4.2.1 Using Digital Multimeters to Verify Cell OCV and Internal Resistance

High-precision digital multimeters are used to measure cell terminal voltage in a resting state, with measurement accuracy required to reach the microvolt level. Test items include initial OCV, post-charge/discharge OCV, and long-term OCV monitoring. Acceptance criteria require OCV differences within the same batch of cells to be ≤ 10mV to ensure consistency.

Cell internal resistance testing includes both AC internal resistance and DC internal resistance. AC internal resistance testing applies a small AC signal, typically at 1kHz. DC internal resistance is calculated through pulse charge-discharge testing.

4.2.2 Electrochemical Impedance Spectroscopy (EIS) Testing Method

A small sinusoidal excitation signal is applied over a wide frequency range (0.1Hz-1MHz) to measure the frequency response of cell impedance. Test content includes ohmic impedance, charge transfer impedance, and diffusion impedance. Application value includes rapid cell quality screening, consistency evaluation, and aging state monitoring.

4.2.3 Cell Charge-Discharge Cycle Life Testing

Continuous charge-discharge cycle testing is performed on cells to record capacity fade and internal resistance growth curves. Test conditions include standard cycling, accelerated aging, and working-condition simulation. Test indicators include cycle life, capacity retention, and internal resistance growth rate.

4.2.4 Cell Consistency Verification

Test content includes capacity consistency (deviation ≤ 3%), internal resistance consistency (deviation ≤ 5%), OCV consistency (difference ≤ 10mV), and self-discharge consistency (difference ≤ 10%). Statistical process control methods are used to identify abnormal cells.

5. Decision and Control Module Test Plan

5.1 Test Objects

Core components of the decision and control module include intelligent chips (CPU, GPU, NPU, and other computing cores), controllers, and ECU electronic control units.

5.2.1 PCIe High-Speed Data Transmission Testing

Transmitter testing uses automated test solutions to evaluate transmitter signal quality. For PCIe Gen5 and above, PAM4 signal parameters such as signal-to-noise-and-distortion ratio and uncorrelated jitter need to be tested. Receiver testing performs receiver tolerance tests to verify BER performance under stressed signals. Link testing checks parameters such as transmission loss, impedance continuity, and crosstalk. Protocol testing uses protocol analyzers to verify data transmission integrity.

5.2.2 Automotive Ethernet Communication Testing

Physical-layer testing uses oscilloscopes to measure Ethernet electrical characteristics, supporting testing from 10/100/1000BASE-T to 10G/100G Ethernet. Link-layer testing verifies link establishment, maintenance, and disconnection. Network-layer testing checks network topology, routing protocols, and traffic control. QoS testing measures latency, jitter, and packet loss.

5.2.3 Data Transmission Integrity Verification

End-to-end latency testing measures the total delay from sensor data acquisition to actuator command delivery, typically under 10ms. Data integrity testing uses CRC, parity checking, and other methods to verify transmission correctness. Bandwidth testing checks actual bandwidth utilization of each communication link.

6. Joint Module Test Plan

6.1 Test Objects

The joint module includes linear actuators (composed of frameless torque motors, ball screws, bearings, etc.) and rotary actuators (composed of frameless torque motors, harmonic reducers, torque sensors, bearings, etc.).

6.2.1 Motor Drive Performance Analysis Testing

Mixed-signal oscilloscopes together with motor drive analysis software are used to simultaneously capture motor phase voltage, phase current, rotor position, and other signals.

Steady-state performance testing includes torque-speed characteristics, efficiency maps, and power factor. Dynamic performance testing includes starting characteristics, acceleration/deceleration characteristics, and sudden load response. Control strategy verification includes PWM modulation strategy, current-loop control, and speed-loop control.

6.2.2 Motor Strategy Verification

FOC control verification tests the correctness of field-oriented control algorithms. PID parameter optimization uses step response and frequency response tests to optimize control parameters. Sensorless control testing evaluates startup performance, low-speed performance, and dynamic response of sensorless control algorithms.

6.2.3 Actuator Precision Testing

Position accuracy testing uses high-precision encoders to measure actual actuator position, including positioning accuracy, repeatability, and backlash. Speed accuracy testing measures speed fluctuation under different speeds. Torque accuracy testing verifies torque control precision and response speed.

6.2.4 Torque Sensor Calibration

Static calibration applies known torque to establish torque-output curves. Dynamic calibration tests sensor response characteristics. Temperature compensation testing evaluates sensor characteristics at different temperatures.

7. Dexterous Hand Module Test Plan

7.1 Test Objects

The dexterous hand module includes a drive system (coreless motors, stepper motors, planetary reducers, ball screws, etc.) and a sensing system (tactile sensors, torque sensors, etc.).

7.2.1 Wide-Bandgap (WBG) Device Dynamic Performance Testing

Wide-bandgap power devices such as GaN and SiC are widely used in motor drives and require dynamic characteristic testing. Double-pulse testing (DPT) evaluates switching performance. Test content includes switching time, switching loss, reverse recovery, and dynamic on-resistance Rds(on).

7.2.2 Motor Drive Performance Verification

Coreless motor characteristic testing includes torque-speed curves, efficiency characteristics, and response time. Stepper motor characteristic testing includes pull-in torque, pull-out torque, and step angle accuracy.

7.2.3 Sensor Precision Testing

Tactile sensor testing includes spatial resolution, force sensitivity, response time, and linearity. Torque sensor testing includes measurement range, accuracy, repeatability, and hysteresis.

8. Other Module Test Plans

8.1 Structural Part Testing

Structural strength testing includes static strength, fatigue strength, and impact strength. Material property testing includes density, elastic modulus, and thermal expansion coefficient.

8.2 Communication Device Testing

Wireless communication testing includes Wi-Fi, Bluetooth, and 5G performance. Wired communication testing includes CAN bus testing and RS485 communication testing.

8.3 Heat Dissipation Device Testing

Thermal performance testing includes thermal resistance, heat dissipation capability, and temperature distribution. Fan performance testing includes airflow, static pressure, and noise.

9. Reliability Test Items and Standards

9.1 Environmental Reliability Testing

  • High-temperature operating test (reference standards: GB/T 2423.2, IEC 60068-2-2): evaluates robot and component performance under high-temperature environments. Test temperatures are typically set at 55°C, 70°C, or higher, with durations not less than 2 hours. Key performance parameters are monitored during testing to ensure normal operation under high temperature.
  • Low-temperature operating test (reference standards: GB/T 2423.1, IEC 60068-2-1): evaluates robot and component performance under low-temperature environments. Test temperatures are typically set at -20°C, -40°C, or lower, with durations not less than 2 hours. The focus is on battery performance, motor starting characteristics, and sensor sensitivity under low temperature.
  • Temperature cycling test (reference standards: GB/T 2423.22, IEC 60068-2-14): evaluates adaptability to temperature changes. Testing alternates between high and low temperatures for 10-100 cycles, focusing on structural stress from thermal expansion and contraction, solder joint reliability, and sealing performance.
  • Damp heat steady-state test (reference standards: GB/T 2423.3, IEC 60068-2-78): evaluates operation under high humidity. Typical test conditions are 40°C and 93% RH for 48-96 hours, focusing on electrical insulation, material moisture absorption deformation, and connector reliability.
  • Salt spray test (reference standards: GB/T 2423.17, IEC 60068-2-11): evaluates resistance to salt fog corrosion, suitable for marine or industrial pollution environments. Testing includes NSS, AASS, and CASS, typically lasting 24-96 hours.

9.2 Mechanical Reliability Testing

  • Vibration test (reference standards: GB/T 2423.10, IEC 60068-2-6): simulates vibration during transportation and use. Testing includes sinusoidal, random, and mixed vibration, typically from 5-2000Hz, with acceleration determined by the application scenario. Duration is usually 1-2 hours per axis.
  • Shock test (reference standards: GB/T 2423.5, IEC 60068-2-27): simulates impacts such as drops and collisions. Test waveforms include half-sine, square, and sawtooth waves, with peak acceleration up to 100-500g. Key focuses are structural strength, connector reliability, and solder joint robustness.
  • Drop test (reference standards: GB/T 2423.8, IEC 60068-2-31): simulates accidental drop scenarios. Test height is determined by product weight and application scenario, typically 0.5-1.5m. Drop orientations include face, edge, and corner drops, with 1-3 drops per direction.
  • Fatigue life test: verifies long-term reliability in actual use. Testing includes repeated joint motion testing (typically 100,000 to 1,000,000 cycles), battery charge-discharge cycle testing (typically 500-1000 cycles), and connector insertion/extraction testing (typically 1,000-10,000 cycles).

9.3 Electrical Reliability Testing

  • Power cycling test: verifies the reliability of power devices under temperature cycling stress. The test repeatedly applies power so that the junction temperature cycles between low and high temperatures, typically for 10,000-100,000 cycles, focusing on failure modes such as solder fatigue and bond-wire failure.
  • High-temperature reverse bias test (HTRB) (reference standard: IEC 60747): verifies the stability of power devices under high-temperature reverse bias. Typical conditions are 125-150°C at 80-100% of rated voltage for 1,000 hours.
  • High-temperature gate bias test (HTGB) (reference standard: IEC 60747): verifies the stability of power device gates under high-temperature bias. Typical conditions are 125-150°C at 80-100% of rated gate voltage for 1,000 hours.
  • High-humidity high-temperature reverse bias test (H3TRB) (reference standard: IEC 60747): verifies reliability under high temperature, high humidity, and high voltage. Typical conditions are 85°C, 85% RH, and 80% of rated voltage for 1,000 hours.

9.4 Life Testing

  • Joint fatigue life test: repeated joint motion testing simulates actual operating conditions. Test frequency is typically 0.5-2Hz, with target cycles of 1-5 million. Parameters such as joint accuracy, motor performance, and reducer wear are monitored during testing.
  • Motor life test: evaluates bearing life and winding insulation life through long-term motor operation testing. Test duration is typically 1,000-5,000 hours, with temperature, vibration, noise, and current monitored throughout.
  • Battery cycle life test: evaluates capacity fade and internal resistance growth through battery charge-discharge cycle testing. Target cycles are typically 500-2,000, with capacity retention ≥ 80%.
  • Sensor aging test: evaluates zero drift, sensitivity degradation, and other long-term changes. Test duration is typically 1,000-5,000 hours, with periodic calibration during testing.

10. EMC Test Items and Standards

10.1 EMI Electromagnetic Interference Testing

  • Conducted emission test (reference standards: GB/T 9254, CISPR 32, IEC 61000-6-3): measures electromagnetic interference emitted by the robot through power and signal lines. The frequency range is 150kHz-30MHz, and testing is performed in a shielded room or semi-anechoic chamber. Equipment includes LISN and EMI receivers. Limits depend on equipment category, with Class A less strict and Class B more strict.
  • Radiated emission test (reference standards: GB/T 9254, CISPR 32): measures electromagnetic interference radiated into space. The frequency range is 30MHz-1GHz, with some applications requiring testing up to 6GHz. Testing is performed in semi-anechoic or full anechoic chambers, typically at 3m or 10m distance, with antenna height and polarization varied to capture maximum emissions.
  • Harmonic current emission test (reference standards: GB/T 17625.1, IEC 61000-3-2): measures harmonic currents injected into the AC power source by the robot. The frequency range covers the fundamental to the 40th harmonic. Limits depend on equipment category.
  • Voltage fluctuation and flicker test (reference standards: GB/T 17625.2, IEC 61000-3-3): measures power voltage fluctuations and light flicker caused during robot operation. Typical limits are Pst ≤ 1.0 and Plt ≤ 0.65.

10.2 EMS Electromagnetic Susceptibility Testing

  • Electrostatic discharge immunity test (reference standards: GB/T 17626.2, IEC 61000-4-2): simulates the effects of electrostatic discharge from humans or objects. Testing includes contact discharge (2-8kV) and air discharge (2-15kV), typically 10 discharges for each polarity. Test points include accessible metal housings, buttons, and connectors.
  • Radiated RF electromagnetic field immunity test (reference standards: GB/T 17626.3, IEC 61000-4-3): simulates the effects of external RF electromagnetic fields. The frequency range is 80MHz-1GHz, with some applications requiring testing up to 6GHz. Field strength is typically 1-10V/m, and testing is performed in a full anechoic chamber.
  • Electrical fast transient/burst immunity test (reference standards: GB/T 17626.4, IEC 61000-4-4): simulates transient interference caused by switching operations and relay actions. Test voltage is typically 0.5-4kV, with pulse repetition frequency of 5kHz or 100kHz.
  • Surge immunity test (reference standards: GB/T 17626.5, IEC 61000-4-5): simulates surge voltages caused by lightning or grid switching operations. Test waveforms include combination waves with 1.2/50μs open-circuit voltage and 8/20μs short-circuit current. Typical test voltage is 0.5-4kV.
  • Conducted immunity induced by RF fields (reference standards: GB/T 17626.6, IEC 61000-4-6): simulates interference induced by RF electromagnetic fields on power and signal lines. The frequency range is 150kHz-80MHz, with interference voltage typically 1-10V.
  • Power-frequency magnetic field immunity test (reference standards: GB/T 17626.8, IEC 61000-4-8): simulates the effects of 50Hz or 60Hz magnetic fields, with field strength typically 1-100A/m.
  • Voltage dips, short interruptions, and voltage variation immunity test (reference standards: GB/T 17626.11, IEC 61000-4-11): simulates the effects of grid voltage dips, short interruptions, and voltage changes. Voltage dip magnitude is typically 30%-80%, with duration from 10ms to 1s.

10.3 Robot-Specific EMC Requirements

Robot harmonic emission limits (reference standards: GB/T 37669, IEC/TS 61000-3-4): for high-power robotic equipment with per-phase input current greater than 16A, harmonic emission limits have specific requirements. Limits are determined based on short-circuit ratio (SCR).

Robot immunity requirements (reference standards: GB/T 37668, ISO/IEC 23841): as complex systems, robots need EMC performance that also considers functional safety requirements. Immunity levels are determined according to application scenarios, with industrial robots typically requiring higher levels.

Robot-specific test configuration: during testing, the robot should be configured in a typical operating condition, including installation posture, working mode, and load state. Key functions such as motion control, sensor detection, and communication connection should be monitored throughout the test process.

11. Test Equipment List and Configuration Recommendations

11.1 Summary of Required Test Equipment by Module Test Equipment
Intelligent Perception Module High-performance oscilloscopes (bandwidth ≥ 3.5GHz), MIPI D-PHY/C-PHY test software, low-loading high-impedance probes, arbitrary waveform generators.
Power Module High-precision digital multimeters, electrochemical impedance spectroscopy systems, battery test systems.
Decision and Control Module High-bandwidth oscilloscopes, PCIe test software, BER testers, Ethernet test modules.
Joint Module and Dexterous Hand Module Mixed-signal oscilloscopes, motor drive analysis software, WBG device double-pulse test systems, high-voltage differential probes, current probes.
Reliability Test Equipment High-low temperature chambers, temperature and humidity chambers, salt spray chambers, vibration tables, shock tables, drop testers, power cycling test systems.
EMC Test Equipment EMI receivers, LISN, semi-anechoic/full anechoic chambers, ESD generators, RF signal generators, power amplifiers, EFT/burst generators, surge generators, coupling/decoupling networks (CDN).

11.2 Equipment Selection Recommendations

  • Oscilloscope selection principle: bandwidth should be at least 3-5 times the highest frequency of the signal under test; sampling rate should be at least 2.5 times the bandwidth; memory depth should be sufficient to record complete test waveforms; high-precision measurements require ≥ 12-bit ADC.
  • Probe selection principle: choose probes with low input capacitance and high input resistance; probe bandwidth should be at least equal to oscilloscope bandwidth; high-voltage measurements require differential probes with high CMRR.
  • EMC equipment selection principle: frequency range must cover standard requirements, measurement accuracy must satisfy standard limits, and equipment should have CNAS or CMA certification.

11.3 Test Environment Configuration Requirements

  • Electromagnetic environment: the test area should provide good electromagnetic shielding, and grounding resistance should be less than 1Ω.
  • Temperature and humidity control: temperature 23±2°C and humidity 45%-75% RH.
  • EMC test environment: EMC testing should be performed in shielded rooms, semi-anechoic chambers, or full anechoic chambers, with ambient noise at least 6dB below the limit.
  • Safety protection: high-voltage test areas should be equipped with safety fences and warning signs, along with insulating mats, insulating gloves, emergency stop buttons, and circuit protection devices.

12. Summary and Outlook

As the ideal carrier of embodied intelligence, AI humanoid robots are entering a critical period of technological breakthroughs and commercialization. Establishing a complete testing system covering the full chain from intelligent perception, power endurance, and decision control to joint actuation and dexterous hand operation, together with reliability and EMC testing, is an important guarantee for product quality and reliability.

Through professional test equipment and analytical methods, R&D teams can quickly identify design issues, optimize product performance, and shorten development cycles. In particular, comprehensive test capability needs to be established in fields such as signal integrity testing, high-speed interface testing, motor drive analysis, dynamic testing of wide-bandgap devices, environmental reliability testing, and EMC testing.

Looking ahead, as humanoid robots move toward higher intelligence and higher reliability, testing requirements will become more diverse and more refined. R&D teams are advised to continuously follow the development of testing technology, establish robust test systems, and strictly comply with national and international standards to lay a solid foundation for the industrial application of humanoid robots.

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